General Order 95
Section V
Detailed Construction Requirements for Supply Lines
(Class H, L and T Circuits)
53.4 Bonding
Bonding is not required by these rules. Bonding is not recommended
for circuits of 7,500 volts or less but it is recognized that under certain
conditions it may be deemed necessary.
Where bonding is used the bond wire or strap shall have a conductivity of
not less than No. 10 AWG copper wire, shall in no case be installed on the
top surface of any crossarm, and the bonding shall comply with the following
requirements:
A. Circuits of More than 7,500 Volts
(1)
At Top of Pole:
a) Single Circuit: The bond wire of a single circuit in horizontal,
triangular or vertical configuration at the top circuit position of the pole
may be installed on the face, back or underside of wood crossarms and on
the surface of pole without a protective covering. Crossarm braces may be
connected to such bond wire only where positive electrical contact is made
and the brace is not less than 3 feet vertically above the next conductor
level below the top circuit.
b) More than One Circuit: The bonding of any circuit where more than
one circuit is installed at the top position of a pole shall be in accordance
with the provision of Rule 53.4–A3
below.
Note: Revised October 9, 1996
by Resolution SU–40.
(2) Below Top of Pole: Bond wires of any circuit below the top circuit
position of the pole in horizontal, triangular or vertical configuration
may be installed on the face, back or underside of wood crossarms and on
the surface of pole without a protective covering. Unbonded metal pole line
hardware shall clear such bond wires by not less than 1.5 inches (see Rules
52.7–B1
and 52.7–C
).
Note: Revised September
18, 1967 by Decision No. 72984 and October 9, 1996 by Resolution SU–40.
(3) Conductors of More than One Circuit at Same Level: Where conductors
of more than one circuit are at the same level, in horizontal, triangular
or vertical configuration, bond wire may be installed on the face, back or
underside of wood crossarms and on the surface of pole without a protective
covering. Unbonded metal pole line hardware shall clear such bond wires by
not less than 1.5 inches (see Rules 52.7–B1
and 52.7–C)
.
Note: Revised September
18, 1967 by Decision No. 72984 and October 9, 1996 by Resolution SU–40.
a)
Separately Bonded Circuits: Where conductors of not more than two
circuits are at the same level and separately bonded, such bond wires shall
be separated on the crossarm and on the surface of the pole by not less than
6 inches.
Note: Revised
September 18, 1967 by Decision No. 72984 and January 21,1992, by Resolution
SU–10.
b) Hardware Bond Wires: Where work is to be performed at such locations,
the grounding of hardware bond wires shall be in accordance with
Rule 52.7–F
.
Note: Revised
January 21,1992, by Resolution SU–10.
B.
Circuits of 7,500 Volts or Less
The bonding of circuits
of 7,500 volts or less shall comply with the following:
Bond wires shall
not be less than 1.5 inches from metal braces and all other hardware except
the metal pins and dead ends which are bonded; and
Bond wire of separate circuits shall be separated on crossarms and poles
by not less than 3 inches.
Note:
Revised January 21,1992, by Resolution SU–10 and October 9, 1996 by Resolution
SU–40.